Micron Technology Inc.
Obraz może przedstawiać obraz.
Szczegóły produktu można znaleźć w specyfikacjach.
MT48LC64M8A2TG-75:C TR
Pokaż szczegóły Arkusze danych

MT48LC64M8A2TG-75:C TR

Product Overview

Category

The MT48LC64M8A2TG-75:C TR belongs to the category of dynamic random access memory (DRAM) chips.

Use

This product is primarily used in computer systems and electronic devices for data storage and retrieval purposes.

Characteristics

  • High-speed performance: The MT48LC64M8A2TG-75:C TR offers fast data access and transfer rates, making it suitable for applications that require quick processing.
  • Large storage capacity: With a capacity of 64 megabits (8 megabytes), this DRAM chip can store a significant amount of data.
  • Low power consumption: The MT48LC64M8A2TG-75:C TR is designed to operate efficiently with minimal power consumption.
  • Compact package: It comes in a small form factor package, allowing for easy integration into various electronic devices.
  • RoHS compliant: This product adheres to the Restriction of Hazardous Substances directive, ensuring its environmental friendliness.

Packaging/Quantity

The MT48LC64M8A2TG-75:C TR is typically packaged in tape and reel format. Each reel contains a specific quantity of chips, usually around 2500 units.

Specifications

  • Organization: 64M x 8 bits
  • Voltage Supply: 3.3V
  • Access Time: 7.5 ns
  • Operating Temperature Range: -40°C to +85°C
  • Package Type: TSOP II

Detailed Pin Configuration

The MT48LC64M8A2TG-75:C TR has a total of 54 pins. Here is a detailed pin configuration:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. WE#
  12. CAS#
  13. RAS#
  14. A0
  15. A1
  16. A2
  17. A3
  18. A4
  19. A5
  20. A6
  21. A7
  22. A8
  23. A9
  24. A10
  25. A11
  26. A12
  27. A13
  28. A14
  29. A15
  30. A16
  31. A17
  32. A18
  33. A19
  34. A20
  35. A21
  36. A22
  37. A23
  38. A24
  39. A25
  40. A26
  41. A27
  42. A28
  43. A29
  44. A30
  45. A31
  46. NC
  47. NC
  48. NC
  49. NC
  50. VDDQ
  51. VSSQ
  52. NC
  53. NC
  54. VSS

Functional Features

  • Random access: The MT48LC64M8A2TG-75:C TR allows for random access to stored data, enabling quick retrieval and modification.
  • Refresh capability: It incorporates a refresh mechanism to maintain the integrity of stored data over time.
  • Burst mode operation: This DRAM chip supports burst mode operation, allowing for efficient sequential data access.

Advantages and Disadvantages

Advantages

  • High-speed performance enables fast data processing.
  • Large storage capacity accommodates a significant amount of data.
  • Low power consumption contributes to energy efficiency.
  • Compact package facilitates easy integration into electronic devices.
  • RoHS compliance ensures environmental friendliness.

Disadvantages

  • Limited compatibility: The MT48LC64M8A2TG-75:C TR may not be compatible with all systems or devices.
  • Sensitivity to external factors: DRAM chips are susceptible to data loss in case of power failure or electromagnetic interference.

Working Principles

The MT48LC64M8A2TG-75:C TR operates based on the principles of dynamic random access memory. It stores data in capacitors within an array of cells, where each cell represents a bit of information. To retain the stored data, the chip periodically refreshes the charge on the capacitors. When data needs to be accessed, the chip activates the appropriate row and column addresses to retrieve or modify the desired information.

Detailed Application Field Plans

The MT48LC64M8A2TG-75:C TR is widely used in various applications, including: 1. Personal computers 2. Laptops and notebooks 3. Servers 4. Networking equipment 5. Mobile devices 6. Consumer electronics 7. Automotive systems 8. Industrial automation

Detailed and Complete Alternative Models

  1. MT48LC32M8A2TG-75

Wymień 10 typowych pytań i odpowiedzi związanych z zastosowaniem MT48LC64M8A2TG-75:C TR w rozwiązaniach technicznych

Sure! Here are 10 common questions and answers related to the application of MT48LC64M8A2TG-75:C TR in technical solutions:

  1. Q: What is the MT48LC64M8A2TG-75:C TR? A: The MT48LC64M8A2TG-75:C TR is a specific type of synchronous dynamic random-access memory (SDRAM) chip.

  2. Q: What is the capacity of the MT48LC64M8A2TG-75:C TR? A: The MT48LC64M8A2TG-75:C TR has a capacity of 64 megabits (8 megabytes).

  3. Q: What does the "75:C" in the part number signify? A: The "75:C" indicates the speed grade and temperature range of the chip. In this case, it operates at a maximum frequency of 75 MHz and can withstand a commercial temperature range.

  4. Q: What are some typical applications for the MT48LC64M8A2TG-75:C TR? A: The MT48LC64M8A2TG-75:C TR is commonly used in various technical solutions such as networking equipment, telecommunications devices, industrial automation systems, and embedded systems.

  5. Q: What is the voltage requirement for the MT48LC64M8A2TG-75:C TR? A: The MT48LC64M8A2TG-75:C TR operates at a voltage of 3.3 volts (VDD).

  6. Q: Does the MT48LC64M8A2TG-75:C TR support multiple banks? A: Yes, the MT48LC64M8A2TG-75:C TR supports four internal banks, allowing for concurrent access to different memory locations.

  7. Q: What is the data transfer rate of the MT48LC64M8A2TG-75:C TR? A: The MT48LC64M8A2TG-75:C TR has a maximum data transfer rate of 150 megabytes per second (MB/s).

  8. Q: Can the MT48LC64M8A2TG-75:C TR be used in both read and write operations? A: Yes, the MT48LC64M8A2TG-75:C TR supports both read and write operations, making it suitable for various data storage and retrieval tasks.

  9. Q: Does the MT48LC64M8A2TG-75:C TR have any power-saving features? A: Yes, the MT48LC64M8A2TG-75:C TR incorporates power-down and self-refresh modes to minimize power consumption when not actively accessed.

  10. Q: Is the MT48LC64M8A2TG-75:C TR RoHS compliant? A: Yes, the MT48LC64M8A2TG-75:C TR is compliant with the Restriction of Hazardous Substances (RoHS) directive, ensuring it meets certain environmental standards.

Please note that these answers are general and may vary depending on specific technical requirements and application scenarios.