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MX25L12845GMI-10G

MX25L12845GMI-10G

Product Overview

Category

The MX25L12845GMI-10G belongs to the category of non-volatile memory integrated circuits.

Use

This product is primarily used for storing and retrieving data in electronic devices such as computers, smartphones, and other digital devices.

Characteristics

  • Non-volatile: The MX25L12845GMI-10G retains stored data even when power is removed.
  • High capacity: It has a storage capacity of 128 megabits (16 megabytes).
  • High speed: The product offers fast read and write operations.
  • Low power consumption: It operates efficiently with low power requirements.

Package

The MX25L12845GMI-10G is available in a small form factor package, commonly known as SOP-8 (Small Outline Package).

Essence

The essence of this product lies in its ability to provide reliable and high-capacity non-volatile memory storage for various electronic devices.

Packaging/Quantity

The MX25L12845GMI-10G is typically packaged in reels or tubes, containing a specific quantity of chips per package. The exact packaging and quantity may vary depending on the manufacturer and supplier.

Specifications

  • Memory Capacity: 128 megabits (16 megabytes)
  • Interface: Serial Peripheral Interface (SPI)
  • Operating Voltage: 2.7V - 3.6V
  • Operating Temperature Range: -40°C to +85°C
  • Erase/Program Time: Typically 4 seconds for a sector erase, and 0.5 milliseconds for a byte program
  • Data Retention: Up to 20 years

Detailed Pin Configuration

The MX25L12845GMI-10G features an SOP-8 package with the following pin configuration:

  1. Chip Select (/CS)
  2. Serial Clock (SCLK)
  3. Serial Data Input (SI)
  4. Serial Data Output (SO)
  5. Write Protect (/WP)
  6. Hold (/HOLD)
  7. Ground (GND)
  8. Power Supply (VCC)

Functional Features

  • High-speed data transfer: The MX25L12845GMI-10G supports fast serial communication, enabling quick data transfer between the memory and the host device.
  • Sector erase and byte program: It allows for efficient erasing and programming of data at the sector and byte level, providing flexibility in data management.
  • Write protection: The write protect pin (/WP) can be used to prevent accidental modification or deletion of stored data.
  • Hold function: The hold pin (/HOLD) allows the host device to pause ongoing operations without losing any data.

Advantages and Disadvantages

Advantages

  • Large storage capacity
  • Fast read and write operations
  • Low power consumption
  • Compact form factor
  • Long data retention period

Disadvantages

  • Limited compatibility with certain devices that do not support the SPI interface
  • Relatively higher cost compared to other memory options with lower capacities

Working Principles

The MX25L12845GMI-10G utilizes the Serial Peripheral Interface (SPI) protocol to communicate with the host device. It stores data in non-volatile memory cells, which retain information even when power is removed. The memory cells are organized into sectors, allowing for efficient erasure and programming of data.

Detailed Application Field Plans

The MX25L12845GMI-10G finds applications in various electronic devices, including but not limited to: - Computers and laptops - Smartphones and tablets - Digital cameras - Gaming consoles - Automotive electronics - Industrial control systems

Detailed and Complete Alternative Models

  • MX25L25635FMI-10G: 256 megabit (32 megabyte) capacity, similar characteristics and package.
  • MX25L6406EMI-12G: 640 megabit (80 megabyte) capacity, similar characteristics and package.
  • MX25L12873FM2I-10G: 128 megabit (16 megabyte) capacity, different package (WSON-8).

These alternative models offer varying capacities and package options to suit different requirements.

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Wymień 10 typowych pytań i odpowiedzi związanych z zastosowaniem MX25L12845GMI-10G w rozwiązaniach technicznych

  1. Question: What is the MX25L12845GMI-10G?
    Answer: The MX25L12845GMI-10G is a specific model of flash memory chip manufactured by Macronix. It has a capacity of 128 megabits (16 megabytes) and operates at a speed of 10 MHz.

  2. Question: What are some common applications for the MX25L12845GMI-10G?
    Answer: The MX25L12845GMI-10G is commonly used in various technical solutions such as consumer electronics, automotive systems, industrial equipment, networking devices, and more.

  3. Question: How does the MX25L12845GMI-10G connect to other components in a system?
    Answer: The MX25L12845GMI-10G typically connects to a microcontroller or a host device using a standard serial peripheral interface (SPI) protocol.

  4. Question: What is the voltage requirement for the MX25L12845GMI-10G?
    Answer: The MX25L12845GMI-10G operates at a voltage range of 2.7V to 3.6V.

  5. Question: Can the MX25L12845GMI-10G be easily soldered onto a PCB?
    Answer: Yes, the MX25L12845GMI-10G comes in a standard surface-mount package (SOIC) which can be easily soldered onto a printed circuit board (PCB).

  6. Question: Does the MX25L12845GMI-10G support hardware write protection?
    Answer: Yes, the MX25L12845GMI-10G provides hardware write protection features to prevent accidental or unauthorized modification of data stored in the flash memory.

  7. Question: What is the typical lifespan of the MX25L12845GMI-10G?
    Answer: The MX25L12845GMI-10G has a typical endurance of 100,000 program/erase cycles, ensuring reliable and long-lasting performance.

  8. Question: Can the MX25L12845GMI-10G operate in extreme temperature conditions?
    Answer: Yes, the MX25L12845GMI-10G is designed to operate in a wide temperature range, typically from -40°C to +85°C, making it suitable for various environments.

  9. Question: Does the MX25L12845GMI-10G support software/firmware updates?
    Answer: Yes, the MX25L12845GMI-10G can be used to store software or firmware updates, allowing for easy and efficient system upgrades.

  10. Question: Are there any specific programming requirements for the MX25L12845GMI-10G?
    Answer: The MX25L12845GMI-10G requires specific commands and protocols to read from, write to, or erase its memory. These instructions are usually provided in the datasheet or application notes by the manufacturer.