Alliance Memory, Inc.
Obraz może przedstawiać obraz.
Szczegóły produktu można znaleźć w specyfikacjach.
AS4C128M16D3LA-12BIN
Pokaż szczegóły Arkusze danych

AS4C128M16D3LA-12BIN

Product Overview

Category

AS4C128M16D3LA-12BIN belongs to the category of dynamic random-access memory (DRAM) modules.

Use

It is primarily used as a main memory component in various electronic devices such as computers, servers, and embedded systems.

Characteristics

  • High-speed data access and retrieval capabilities
  • Volatile memory that requires constant power supply
  • Large storage capacity
  • Compact form factor
  • Compatible with industry-standard interfaces

Package

AS4C128M16D3LA-12BIN is packaged in a small outline dual in-line memory module (SODIMM) format.

Essence

The essence of AS4C128M16D3LA-12BIN lies in its ability to store and retrieve data quickly, making it an essential component for efficient computing.

Packaging/Quantity

AS4C128M16D3LA-12BIN is typically sold in individual units or in bulk quantities, depending on the requirements of the customer.

Specifications

  • Model: AS4C128M16D3LA-12BIN
  • Memory Type: DDR3 SDRAM
  • Capacity: 2GB (128 Meg x 16)
  • Speed: 1200 MHz
  • Voltage: 1.5V
  • CAS Latency: 12
  • Organization: 128M words x 16 bits
  • Package Type: SODIMM
  • Pin Count: 204

Detailed Pin Configuration

The pin configuration of AS4C128M16D3LA-12BIN is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. VDD
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. BA0
  37. BA1
  38. RAS#
  39. CAS#
  40. WE#
  41. VSS
  42. VREF
  43. CK
  44. CK#
  45. CKE
  46. CS#
  47. DM0
  48. DM1
  49. VSS
  50. VDD

Functional Features

  • High-speed data transfer rate for improved system performance
  • Low power consumption for energy efficiency
  • Error correction capabilities for enhanced reliability
  • Support for advanced memory management features
  • Compatibility with various operating systems and platforms

Advantages and Disadvantages

Advantages

  • Fast data access and retrieval speeds
  • Large storage capacity
  • Compact form factor
  • Energy-efficient operation
  • Error correction capabilities

Disadvantages

  • Volatile memory requires constant power supply
  • Relatively higher cost compared to other memory technologies
  • Limited lifespan due to the finite number of read/write cycles

Working Principles

AS4C128M16D3LA-12BIN operates based on the principles of dynamic random-access memory (DRAM). It stores data in capacitors within its memory cells, which are organized in a matrix. To access or modify data, the memory controller sends appropriate signals to the specific row and column addresses, allowing the charge stored in the capacitors to be read or updated.

Detailed Application Field Plans

AS4C128M16D3LA-12BIN finds applications in various fields, including: 1. Personal computers 2. Laptops and notebooks 3. Servers and data centers 4. Networking equipment 5. Industrial automation systems 6. Medical devices 7. Automotive electronics 8. Consumer electronics

Detailed and Complete Alternative Models

Some alternative models to AS4C128M16D3LA-12BIN include: 1. AS4C256M16D3LA-12BIN 2. AS4C512M16D3LA-12BIN 3. AS4C1024M16D3LA-12BIN 4. AS4C2048M16D3LA-12BIN

These alternative models offer higher capacities while maintaining similar specifications and compatibility.

Word count: 570 words

Wymień 10 typowych pytań i odpowiedzi związanych z zastosowaniem AS4C128M16D3LA-12BIN w rozwiązaniach technicznych

Sure! Here are 10 common questions and answers related to the application of AS4C128M16D3LA-12BIN in technical solutions:

  1. Question: What is the capacity of the AS4C128M16D3LA-12BIN memory module?
    - Answer: The AS4C128M16D3LA-12BIN has a capacity of 128 megabits (16 megabytes).

  2. Question: What is the operating voltage range for this memory module?
    - Answer: The AS4C128M16D3LA-12BIN operates at a voltage range of 1.7V to 1.95V.

  3. Question: What is the clock frequency supported by this memory module?
    - Answer: The AS4C128M16D3LA-12BIN supports a clock frequency of up to 166 MHz.

  4. Question: What is the data transfer rate of this memory module?
    - Answer: The AS4C128M16D3LA-12BIN has a maximum data transfer rate of 333 Mbps.

  5. Question: Can this memory module be used in both commercial and industrial applications?
    - Answer: Yes, the AS4C128M16D3LA-12BIN is suitable for both commercial and industrial applications.

  6. Question: Does this memory module support ECC (Error Correction Code)?
    - Answer: No, the AS4C128M16D3LA-12BIN does not support ECC.

  7. Question: What is the package type of this memory module?
    - Answer: The AS4C128M16D3LA-12BIN comes in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package.

  8. Question: Is this memory module compatible with DDR3 memory controllers?
    - Answer: Yes, the AS4C128M16D3LA-12BIN is compatible with DDR3 memory controllers.

  9. Question: Can this memory module be used in laptops or desktop computers?
    - Answer: Yes, the AS4C128M16D3LA-12BIN can be used in both laptops and desktop computers.

  10. Question: What is the operating temperature range for this memory module?
    - Answer: The AS4C128M16D3LA-12BIN has an operating temperature range of -40°C to +85°C.

Please note that these answers are based on general information about the AS4C128M16D3LA-12BIN memory module. It's always recommended to refer to the datasheet or consult the manufacturer for specific details and application requirements.