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AS4C128M16D3B-12BCNTR

AS4C128M16D3B-12BCNTR

Product Overview

Category

AS4C128M16D3B-12BCNTR belongs to the category of dynamic random-access memory (DRAM).

Use

It is primarily used as a main memory component in various electronic devices such as computers, servers, and mobile devices.

Characteristics

  • High-speed data access
  • Volatile memory
  • Large storage capacity
  • Low power consumption
  • Compact package size

Package

AS4C128M16D3B-12BCNTR is available in a small outline dual in-line memory module (SODIMM) package.

Essence

The essence of AS4C128M16D3B-12BCNTR lies in its ability to store and retrieve data quickly, making it an essential component for efficient data processing in electronic devices.

Packaging/Quantity

AS4C128M16D3B-12BCNTR is typically packaged in trays or reels, with each tray/reel containing a specific quantity of memory modules. The exact quantity may vary depending on the manufacturer's specifications.

Specifications

  • Memory Type: DDR3 SDRAM
  • Capacity: 2GB (128 Meg x 16)
  • Speed: 1200 MHz
  • Voltage: 1.5V
  • Organization: 128M words x 16 bits
  • Refresh: Auto-refresh and self-refresh modes supported
  • Operating Temperature: -40°C to +85°C

Detailed Pin Configuration

The AS4C128M16D3B-12BCNTR module has a total of 240 pins arranged in a specific configuration. The pinout diagram is as follows:

[Pin Diagram]

Functional Features

  • High-speed data transfer rate
  • Support for advanced memory management features
  • Error correction capabilities
  • Low power consumption in standby mode
  • Compatibility with various memory controllers

Advantages and Disadvantages

Advantages

  • Fast data access speeds improve overall system performance.
  • Large storage capacity allows for efficient multitasking and data-intensive applications.
  • Low power consumption helps conserve energy and extend battery life in mobile devices.

Disadvantages

  • Volatile memory requires constant power supply to retain data.
  • Relatively higher cost compared to other types of memory.

Working Principles

AS4C128M16D3B-12BCNTR operates based on the principles of dynamic random-access memory. It stores data in capacitors within each memory cell, which are periodically refreshed to maintain the stored information. When a read or write operation is performed, the memory controller sends appropriate signals to access the desired data.

Detailed Application Field Plans

AS4C128M16D3B-12BCNTR finds extensive use in various electronic devices and applications, including: - Personal computers - Laptops and notebooks - Servers - Mobile devices (smartphones, tablets) - Gaming consoles - Networking equipment

Detailed and Complete Alternative Models

Some alternative models that can be considered as alternatives to AS4C128M16D3B-12BCNTR include: - AS4C256M16D3B-12BCNTR: Higher capacity variant (4GB) with similar specifications - AS4C64M16D3B-12BCNTR: Lower capacity variant (1GB) with similar specifications - AS4C128M16D3B-12BIN: Industrial-grade version with extended temperature range

These alternative models provide flexibility in terms of capacity and specific requirements of different applications.

Word count: 500 words

Wymień 10 typowych pytań i odpowiedzi związanych z zastosowaniem AS4C128M16D3B-12BCNTR w rozwiązaniach technicznych

1. What is the AS4C128M16D3B-12BCNTR?

The AS4C128M16D3B-12BCNTR is a specific type of memory chip commonly used in technical solutions.

2. What is the capacity of the AS4C128M16D3B-12BCNTR?

The AS4C128M16D3B-12BCNTR has a capacity of 128 megabits (16 megabytes).

3. What is the speed rating of the AS4C128M16D3B-12BCNTR?

The AS4C128M16D3B-12BCNTR has a speed rating of 12 nanoseconds.

4. What is the voltage requirement for the AS4C128M16D3B-12BCNTR?

The AS4C128M16D3B-12BCNTR operates at a voltage of 1.8 volts.

5. What is the package type of the AS4C128M16D3B-12BCNTR?

The AS4C128M16D3B-12BCNTR comes in a BGA (Ball Grid Array) package.

6. Can the AS4C128M16D3B-12BCNTR be used in mobile devices?

Yes, the AS4C128M16D3B-12BCNTR can be used in mobile devices as it operates at a low voltage and has a compact package.

7. Is the AS4C128M16D3B-12BCNTR compatible with DDR3 memory interfaces?

Yes, the AS4C128M16D3B-12BCNTR is compatible with DDR3 memory interfaces.

8. Can the AS4C128M16D3B-12BCNTR be used in industrial applications?

Yes, the AS4C128M16D3B-12BCNTR is suitable for use in industrial applications due to its reliability and performance.

9. What is the temperature range for the AS4C128M16D3B-12BCNTR?

The AS4C128M16D3B-12BCNTR has a temperature range of -40°C to +85°C.

10. Can the AS4C128M16D3B-12BCNTR be used as a replacement for other memory chips?

In some cases, the AS4C128M16D3B-12BCNTR can be used as a replacement for other memory chips with similar specifications, but it is always recommended to consult the datasheet and verify compatibility before substitution.