Alliance Memory, Inc.
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AS4C128M16D2-25BIN
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AS4C128M16D2-25BIN

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory module
  • Characteristics:
    • High-speed performance
    • Large storage capacity
    • Low power consumption
  • Package: BGA (Ball Grid Array)
  • Essence: Dynamic Random Access Memory (DRAM)
  • Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

  • Part Number: AS4C128M16D2-25BIN
  • Organization: 128 Megabit x 16
  • Operating Voltage: 2.5V
  • Speed Grade: -25
  • Interface: Double Data Rate (DDR2)
  • Clock Frequency: 200 MHz
  • Refresh Mode: Auto-refresh and self-refresh
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C128M16D2-25BIN has a total of 60 pins arranged in a specific configuration. The pinout is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. DQ8
  11. DQ9
  12. DQ10
  13. DQ11
  14. DQ12
  15. DQ13
  16. DQ14
  17. DQ15
  18. VSS
  19. NC
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. BA0
  37. BA1
  38. RAS#
  39. CAS#
  40. WE#
  41. CK
  42. CKE
  43. CS#
  44. DM0
  45. DM1
  46. VSS
  47. VDDQ
  48. DQS0
  49. DQS1
  50. DQS2
  51. DQS3
  52. VREF
  53. VSS
  54. NC
  55. VSS
  56. VDD
  57. VDDQ
  58. VSS
  59. VSS
  60. VSS

Functional Features

  • High-speed data transfer rate
  • Burst mode operation for efficient data access
  • On-die termination (ODT) for improved signal integrity
  • Auto and self-refresh modes for power-saving operation
  • Internal calibration for optimal performance

Advantages and Disadvantages

Advantages: - High-speed performance allows for faster data processing - Large storage capacity accommodates extensive data storage requirements - Low power consumption reduces energy usage and heat generation

Disadvantages: - Limited compatibility with older DDR2 memory modules - Relatively higher cost compared to other memory technologies

Working Principles

The AS4C128M16D2-25BIN is a dynamic random access memory (DRAM) module that stores and retrieves data using electrical charges stored in capacitors within the memory cells. The memory cells are organized into a matrix of rows and columns, allowing for efficient data access. The DDR2 interface enables high-speed data transfer by utilizing both the rising and falling edges of the clock signal.

Detailed Application Field Plans

The AS4C128M16D2-25BIN is commonly used in various applications that require high-speed and large-capacity memory, such as: - Computer systems - Networking equipment - Industrial control systems - Telecommunications devices - Consumer electronics

Detailed and Complete Alternative Models

  1. AS4C128M16D2A-25BIN
  2. AS4C128M16D2B-25BIN
  3. AS4C128M16D2C-25BIN
  4. AS4C128M16D2D-25BIN
  5. AS4C128M16D2E-25BIN

These alternative models offer similar specifications and functionality to the AS4C128M16D2-25BIN, providing options for different application requirements.

(Note: The content provided above is approximately 320 words. Additional information can be added to meet the required word count of 1100 words.)

Wymień 10 typowych pytań i odpowiedzi związanych z zastosowaniem AS4C128M16D2-25BIN w rozwiązaniach technicznych

Sure! Here are 10 common questions and answers related to the application of AS4C128M16D2-25BIN in technical solutions:

  1. Question: What is the capacity of the AS4C128M16D2-25BIN?
    Answer: The AS4C128M16D2-25BIN has a capacity of 128 megabits (16 megabytes).

  2. Question: What is the operating voltage range for this memory module?
    Answer: The AS4C128M16D2-25BIN operates at a voltage range of 2.5V.

  3. Question: What is the maximum clock frequency supported by this memory module?
    Answer: The AS4C128M16D2-25BIN supports a maximum clock frequency of 200 MHz.

  4. Question: Can this memory module be used in both commercial and industrial applications?
    Answer: Yes, the AS4C128M16D2-25BIN is suitable for both commercial and industrial applications.

  5. Question: Does this memory module support synchronous operation?
    Answer: Yes, the AS4C128M16D2-25BIN supports synchronous operation.

  6. Question: What is the data transfer rate of this memory module?
    Answer: The AS4C128M16D2-25BIN has a data transfer rate of 400 Mbps.

  7. Question: Is this memory module compatible with DDR2 memory interfaces?
    Answer: Yes, the AS4C128M16D2-25BIN is designed to be compatible with DDR2 memory interfaces.

  8. Question: Can this memory module be used in embedded systems?
    Answer: Yes, the AS4C128M16D2-25BIN is suitable for use in embedded systems.

  9. Question: What is the operating temperature range for this memory module?
    Answer: The AS4C128M16D2-25BIN has an operating temperature range of -40°C to +85°C.

  10. Question: Does this memory module support auto-refresh and self-refresh modes?
    Answer: Yes, the AS4C128M16D2-25BIN supports both auto-refresh and self-refresh modes.

Please note that these answers are based on general information about the AS4C128M16D2-25BIN and may vary depending on specific technical requirements and application scenarios.